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Add SPICE models for BFU520*

This commit is contained in:
Kelvin Ly 2019-04-13 09:21:46 -04:00
parent d250165add
commit 2a1839f8bb
22 changed files with 1222 additions and 0 deletions
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59
sim/models/BFU520A_SPICE_GP.PRM Normal file
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* Filename: BFU520A_GP_SPICE.PRM
* BFU520A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520A 1 2 3
Q1 6 5 7 7 BFU520D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 215f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520W_SPICE_GP.PRM Normal file
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* Filename: BFU520W_GP_SPICE.PRM
* BFU520W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520W 1 2 3
Q1 6 5 7 7 BFU520D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 215f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520XR_SPICE_GP.PRM Normal file
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* Filename: BFU520XR_GP_SPICE.PRM
* BFU520XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520XR 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
* +IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

19
sim/models/BFU520XR_SPICE_GP.PRM.lst Normal file
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.Def:BFU520XR_SPICE_GP_PRM _net1 _net2 _net3 _ref
.Def:BFU520XR _ref _net1 _net2 _net3
BJT:Q1 _net5 _net6 _net7 _net7 Type="npn" Is="7.149e-17" Bf="133.81" Nf="1" Vaf="183.69" Ikf="0.25272" Ise="8.94e-14" Ne="2.5" Br="0.51249" Nr="1" Var="2.4" Ikr="0.03159" Isc="7.149e-17" Nc="1.1" Rb="1.17" Irb="0.02678" Rbm="0.67" Re="0.59" Rc="0.89" Cje="0" Vje="0.75" Mje="0.33" Cjc="0" Vjc="0.75" Mjc="0.33" Xcjc="1" Cjs="0" Vjs="0.75" Mjs="0" Fc="0.5" Vtf="0" Tf="0" Xtf="0" Itf="0" Tr="0"
L:LC_WIRE _net9 _net6 L="316p"
L:LB_WIRE _net4 _net5 L="1130p"
L:LE_WIRE _net7 _net8 L="400p"
L:LC_LEAD _net1 _net9 L="79p"
L:LB_LEAD _net2 _net4 L="0.001p"
L:LE_LEAD _net3 _net8 L="0.001p"
C:CCB _net4 _net9 C="10f"
C:CBASEPAD _net5 _net6 C="215f"
C:CBE _net4 _net8 C="40f"
C:CCE _net8 _net9 C="205f"
C:CEMITTERPAD _net6 _net7 C="235f"
.Def:End
Sub:X1 _ref _net1 _net2 _net3 Type="BFU520XR"
.Def:End

59
sim/models/BFU520X_SPICE_GP.PRM Normal file
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* Filename: BFU520X_GP_SPICE.PRM
* BFU520X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520X 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520_SPICE_GP.PRM Normal file
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* Filename: BFU520_GP_SPICE.PRM
* BFU520 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530A_SPICE_GP.PRM Normal file
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* Filename: BFU530A_GP_SPICE.PRM
* BFU530A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530A 1 2 3
Q1 6 5 7 7 BFU530D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 280f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530W_SPICE_GP.PRM Normal file
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* Filename: BFU530W_GP_SPICE.PRM
* BFU530W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530W 1 2 3
Q1 6 5 7 7 BFU530D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 280f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530XR_SPICE_GP.PRM Normal file
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* Filename: BFU530XR_GP_SPICE.PRM
* BFU530XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530XR 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530X_SPICE_GP.PRM Normal file
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* Filename: BFU530X_GP_SPICE.PRM
* BFU530X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530X 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

41
sim/models/BFU530_GP_die.txt Normal file
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*
* NXP SEMICONDUCTORS Version: 1.0
* Date: November 2013
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530_SPICE_GP.PRM Normal file
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* Filename: BFU530_GP_SPICE.PRM
* BFU530 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550A_SPICE_GP.PRM Normal file
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* Filename: BFU550A_GP_SPICE.PRM
* BFU550A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550A 1 2 3
Q1 6 5 7 7 BFU550D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 300f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550W_SPICE_GP.PRM Normal file
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* Filename: BFU550W_GP_SPICE.PRM
* BFU550W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550W 1 2 3
Q1 6 5 7 7 BFU550D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 300f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550XR_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU550XR_GP_SPICE.PRM
* BFU550XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550XR 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550X_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU550X_GP_SPICE.PRM
* BFU550X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550X 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

41
sim/models/BFU550_GP_die.txt Normal file
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@ -0,0 +1,41 @@
*
* NXP SEMICONDUCTORS Version: 1.0
* Date: November 2013
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU550_GP_SPICE.PRM
* BFU550 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU580G_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU580G_GP_SPICE.PRM
* BFU580G SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT223 DIE MODEL: BFU580D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU580G 1 2 3
Q1 6 5 7 7 BFU580D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 1040p
Le_wire 7 8 1040p
Lc_lead 1 9 800p
Lb_lead 2 4 560p
Le_lead 3 8 260p
Ccb 4 9 100f
Cbasepad 5 6 435f
Cbe 4 8 200f
Cce 8 9 650f
Cemitterpad 6 7 500f
*
.MODEL BFU580D NPN
+IS 142.98E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 505.44E-3
+ISE 178.80E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 63.18E-3
+ISC 142.98E-18
+NC 1.10
+RB 0.585
+IRB 53.56E-3
+RBM 0.335
+RE 0.295
+RC 0.445
+IMAX 2.00
+CJE 1012.08E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 148.32E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 85.11E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU580Q_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU580Q_GP_SPICE.PRM
* BFU580Q SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT89 DIE MODEL: BFU580D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU580Q 1 2 3
Q1 6 5 7 7 BFU580D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 2200p
Le_wire 7 8 1520p
Lc_lead 1 9 650p
Lb_lead 2 4 0.001p
Le_lead 3 8 380p
Ccb 4 9 240f
Cbasepad 5 6 310f
Cbe 4 8 200f
Cce 8 9 550f
Cemitterpad 6 7 500f
*
.MODEL BFU580D NPN
+IS 142.98E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 505.44E-3
+ISE 178.80E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 63.18E-3
+ISC 142.98E-18
+NC 1.10
+RB 0.585
+IRB 53.56E-3
+RBM 0.335
+RE 0.295
+RC 0.445
+IMAX 2.00
+CJE 1012.08E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 148.32E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 85.11E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU590G_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU590G_GP_SPICE.PRM
* BFU590G SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT223 DIE MODEL: BFU590D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU590G 1 2 3
Q1 6 5 7 7 BFU590D
* SOT223 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 1500p
Le_wire 7 8 1040p
Lc_lead 1 9 800p
Lb_lead 2 4 0.001p
Le_lead 3 8 260p
Ccb 4 9 250f
Cbasepad 5 6 725f
Cbe 4 8 110f
Cce 8 9 600f
Cemitterpad 6 7 450f
*
.MODEL BFU590D NPN
+IS 476.61E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 1684.8E-3
+ISE 596.0E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 210.6E-3
+ISC 476.61E-18
+NC 1.10
+RB 0.1755
+IRB 178.53E-3
+RBM 0.1005
+RE 0.0885
+RC 0.1335
+IMAX 2.00
+CJE 3373.6E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 494.4E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 283.7E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU590Q_SPICE_GP.PRM Normal file
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@ -0,0 +1,59 @@
* Filename: BFU590Q_GP_SPICE.PRM
* BFU590Q SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT89 DIE MODEL: BFU590D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU590Q 1 2 3
Q1 6 5 7 7 BFU590D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 2200p
Le_wire 7 8 1600p
Lc_lead 1 9 500p
Lb_lead 2 4 0.001p
Le_lead 3 8 400p
Ccb 4 9 250f
Cbasepad 5 6 725f
Cbe 4 8 110f
Cce 8 9 600f
Cemitterpad 6 7 450f
*
.MODEL BFU590D NPN
+IS 476.61E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 1684.8E-3
+ISE 596.0E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 210.6E-3
+ISC 476.61E-18
+NC 1.10
+RB 0.1755
+IRB 178.53E-3
+RBM 0.1005
+RE 0.0885
+RC 0.1335
+IMAX 2.00
+CJE 3373.6E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 494.4E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 283.7E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS