58 lines
5.2 KiB
Plaintext
58 lines
5.2 KiB
Plaintext
(module "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias" (layer F.Cu) (tedit 5EEFB632)
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(descr "SOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator ipc_gullwing_generator.py")
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(tags "SOIC SO")
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(attr smd)
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(fp_text reference "U16" (at -0.05 4.4 90) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value "AP64501SP-13" (at 0 3.4) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 1.710584 2.56) (end 1.95 2.56) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.710584 2.56) (end -1.95 2.56) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.710584 -2.56) (end 1.95 -2.56) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.710584 -2.56) (end -3.45 -2.56) (layer F.SilkS) (width 0.12))
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(fp_line (start -0.975 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.1))
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(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.1))
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(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.1))
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(fp_line (start -1.95 2.45) (end -1.95 -1.475) (layer F.Fab) (width 0.1))
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(fp_line (start -1.95 -1.475) (end -0.975 -2.45) (layer F.Fab) (width 0.1))
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(fp_line (start -3.7 -2.7) (end -3.7 2.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.7 2.7) (end 3.7 2.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.7 2.7) (end 3.7 -2.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.7 -2.7) (end -3.7 -2.7) (layer F.CrtYd) (width 0.05))
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(fp_text user "${REFERENCE}" (at 0 0) (layer F.Fab)
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(effects (font (size 0.98 0.98) (thickness 0.15)))
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)
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(pad "" smd roundrect (at 0.68 0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974) (tstamp 07aeb4b7-c498-42f3-86f8-25d22565fa82))
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(pad "" smd roundrect (at 0.68 -0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974) (tstamp 80d67328-b745-4435-85ac-648a0cf672b8))
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(pad "" smd roundrect (at -0.68 0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974) (tstamp a45bef4c-76ea-457d-bb46-4cdcc1a6edb4))
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(pad "" smd roundrect (at -0.68 -0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974) (tstamp deb9d2a5-186d-42d6-b00b-b155b98bcb0b))
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(pad "9" smd rect (at 0 0) (size 1.8 4.4) (layers "B.Cu" "B.Mask")
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(solder_mask_margin 0.1) (tstamp 6a62dc47-89d1-4374-9f51-8a25b68f783a))
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(pad "9" thru_hole circle (at 0.65 1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp f4943a48-2eeb-4242-b876-b54487763341))
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(pad "9" thru_hole circle (at -0.65 1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp 51a61442-fa72-441f-862c-4be7a3c8658d))
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(pad "9" thru_hole circle (at 0.65 0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp 5dc3f123-f7a0-4e53-b7fe-5e2db07dff2d))
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(pad "9" thru_hole circle (at -0.65 0.65 270) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp 07a711f5-4aa5-4fba-8848-067fb65506a2))
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(pad "9" thru_hole circle (at 0.65 -0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp f236dc3d-311c-4654-8cea-f143fe4b2321))
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(pad "9" thru_hole circle (at -0.65 -0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp 7111374c-a78f-4e94-bbe7-08b3d5208ff0))
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(pad "9" thru_hole circle (at 0.65 -1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu) (tstamp 784325b5-e128-4657-960a-f865fb167e07))
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(pad "9" thru_hole circle (at -0.65 -1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu)
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(solder_mask_margin 0.3) (tstamp 45535fdc-81c2-4a88-a827-2a4839c8197d))
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(pad "9" smd rect (at 0 0) (size 2.95 4.9) (layers "F.Cu") (tstamp 80aa10e7-ecd1-4c18-8aad-52559933f219))
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(pad "" smd rect (at 0 0) (size 2.71 3.4) (layers "F.Mask") (tstamp 5b7f4d5d-16e8-4ed4-9abc-d50afb71f899))
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(pad "8" smd roundrect (at 2.5625 -1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 824911bd-798e-49ef-a458-3b219be91ba3))
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(pad "7" smd roundrect (at 2.5625 -0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6dc292b4-253c-41bf-a9ca-f7b1aec63408))
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(pad "6" smd roundrect (at 2.5625 0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6236e0b3-44ac-408c-8f68-7ed4ed954ca3))
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(pad "5" smd roundrect (at 2.5625 1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 3b00fd02-47b0-4585-b847-ab2473f5ad7c))
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(pad "4" smd roundrect (at -2.5625 1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 40f3a476-186d-4dff-a9cc-02873790bcb8))
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(pad "3" smd roundrect (at -2.5625 0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9e7feba0-6848-4eef-b234-52a70cb8f487))
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(pad "2" smd roundrect (at -2.5625 -0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 89409c55-2f58-40e1-99bb-a90cd7bcb736))
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(pad "1" smd roundrect (at -2.5625 -1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 4291f827-51a6-4c13-8203-43cce7cbe07d))
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(model "${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm.wrl"
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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