* Filename:  BFU550A_GP_SPICE.PRM
* BFU550A SPICE MODEL
* NXP  SEMICONDUCTORS		version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550A 1 2 3
Q1 6 5 7 7 BFU550D
* SOT23 parasitic model
Lc_wire		9 6 240p
Lb_wire		4 5 1000p 
Le_wire		7 8 1300p
Lc_lead		1 9 60p
Lb_lead		2 4 0.001p
Le_lead		3 8 0.001p
Ccb		4 9 65f
Cbasepad	5 6 300f
Cbe		4 8 65f
Cce		8 9 95f
Cemitterpad	6 7 270f
*
.MODEL  BFU550D   NPN
+IS		119.15E-18 
+BF		133.81
+NF		1.00
+VAF		183.69
+IKF		421.20E-3
+ISE		149.00E-15
+NE		2.50
+BR		512.49E-3
+NR		1.00
+VAR		2.40
+IKR		56.25E-3
+ISC		119.15E-18
+NC		1.10
+RB		0.70
+IRB		44.63E-3
+RBM		0.40
+RE		0.36
+RC		0.54
+IMAX		2.00
+CJE		843.40E-15
+VJE		950.00E-3
+MJE		335.33E-3
+CJC		123.60E-15
+VJC		720.00E-3	
+MJC		318.44E-3	
+XCJC		0.50
+FC		850.00E-3	
+TF		10.04E-12
+XTF		10.00	
+VTF		1.00	
+ITF		70.92E-3	
+PTF		0.00
+TR		0.00
+KF		109.67e-12
+AF		2.00
.ENDS