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bfu520-test-amplifier
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Simulate kind of; gave up and just added a lott of test points to find the right values empirically

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Kelvin Ly 2019-07-11 23:47:36 -04:00
commit a3bdfd5816
27 changed files with 101600 additions and 0 deletions
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163
sim/bfu520_mixer.sch Normal file
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<Qucs Schematic 0.0.19>
<Properties>
<View=16,-300,1664,940,1,100,8>
<Grid=10,10,1>
<DataSet=bfu520_mixer.dat>
<DataDisplay=bfu520_mixer.dpl>
<OpenDisplay=1>
<Script=bfu520_mixer.m>
<RunScript=0>
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<FrameText0=Title>
<FrameText1=Drawn By:>
<FrameText2=Date:>
<FrameText3=Revision:>
</Properties>
<Symbol>
</Symbol>
<Components>
<Pac P1 1 50 450 18 -26 0 1 "1" 1 "50 Ohm" 1 "0 dBm" 0 "915 MHz" 0 "26.85" 0>
<.DC DC1 1 400 720 0 38 0 0 "26.85" 0 "0.001" 0 "1 pA" 0 "1 uV" 0 "no" 0 "150" 0 "no" 0 "none" 0 "CroutLU" 0>
<.SP SP1 1 130 710 0 61 0 0 "lin" 1 "100 MHz" 1 "2 GHz" 1 "50" 1 "no" 0 "1" 0 "2" 0 "no" 0 "no" 0>
<Eqn Eqn1 1 940 720 -31 15 0 0 "ileft=5e-3+I1" 1 "yes" 0>
<Eqn Eqn2 1 940 810 -31 15 0 0 "iright=5e-3-I1" 1 "yes" 0>
<.SW SW1 1 650 730 0 61 0 0 "SP1" 1 "lin" 1 "I1" 1 "-5 mA" 1 "5 mA" 1 "11" 1>
<SPICE X2 1 390 200 -26 -89 1 2 "/home/kelvin/repos/ism-915mhz-transceiver/sim/models/BFU520XR_SPICE_GP.PRM" 1 "_net1,_net2,_net3" 0 "yes" 0 "none" 0>
<SPICE X1 1 550 200 -26 -89 0 0 "/home/kelvin/repos/ism-915mhz-transceiver/sim/models/BFU520XR_SPICE_GP.PRM" 1 "_net1,_net2,_net3" 0 "yes" 0 "none" 0>
<SPICE X3 1 930 200 -26 -89 0 0 "/home/kelvin/repos/ism-915mhz-transceiver/sim/models/BFU520XR_SPICE_GP.PRM" 1 "_net1,_net2,_net3" 0 "yes" 0 "none" 0>
<SPICE X4 1 800 200 -26 -89 1 2 "/home/kelvin/repos/ism-915mhz-transceiver/sim/models/BFU520XR_SPICE_GP.PRM" 1 "_net1,_net2,_net3" 0 "yes" 0 "none" 0>
<GND * 1 390 290 0 0 0 0>
<GND * 1 550 290 0 0 0 0>
<GND * 1 620 300 0 0 0 0>
<GND * 1 730 300 0 0 0 0>
<GND * 1 800 290 0 0 0 0>
<GND * 1 930 290 0 0 0 0>
<GND * 1 990 290 0 0 0 0>
<GND * 1 320 300 0 0 0 0>
<L L1 1 530 -20 -26 10 0 0 "100 nH" 1 "" 0>
<L L2 1 790 -20 -26 10 0 0 "100 nH" 1 "" 0>
<Idc I1 1 470 340 -69 -26 0 3 "ileft" 1>
<Idc I2 1 860 330 -69 -26 0 3 "iright" 1>
<GND * 1 470 400 0 0 0 0>
<GND * 1 860 390 0 0 0 0>
<Vdc V1 1 240 -120 18 -26 0 1 "5 V" 1>
<GND * 1 240 -60 0 0 0 0>
<R R2 1 320 220 -93 -26 1 1 "3 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R1 1 320 120 -93 -26 1 1 "2 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R4 1 620 120 -93 -26 1 1 "2 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R5 1 730 120 -93 -26 1 1 "2 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R3 1 620 250 -93 -26 1 1 "3k Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R6 1 730 250 16 -26 0 1 "3k Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R8 1 990 220 15 -26 0 1 "3k Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R7 1 990 110 15 -26 0 1 "2k Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<Pac P2 1 910 -140 18 -26 0 1 "2" 1 "50 Ohm" 1 "0 dBm" 0 "915 MHz" 0 "26.85" 0>
<R R9 1 630 -110 -26 16 1 2 "330 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<C C3 1 360 530 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
<C C4 1 370 610 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
<C C2 1 190 270 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
<C C1 1 230 350 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
<R R10 1 110 270 -26 15 0 0 "33 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R11 1 120 350 -26 15 0 0 "33 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R12 1 140 530 -26 15 0 0 "33 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R13 1 150 610 -26 15 0 0 "33 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<C C5 1 710 -170 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
<C C6 1 810 -110 -26 17 0 0 "100 pF" 1 "" 0 "neutral" 0>
</Components>
<Wires>
<420 40 420 170 "" 0 0 0 "">
<900 40 900 170 "" 0 0 0 "">
<830 70 830 170 "" 0 0 0 "">
<520 70 520 170 "" 0 0 0 "">
<560 -20 590 -20 "" 0 0 0 "">
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<140 270 160 270 "" 0 0 0 "">
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<Diagrams>
</Diagrams>
<Paintings>
</Paintings>

100053
sim/lna.dat Normal file
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59
sim/lna.dpl Normal file
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<Qucs Schematic 0.0.20>
<Properties>
<View=190,120,1042,1740,1.7792,31,1020>
<Grid=10,10,0>
<DataSet=lna.dat>
<DataDisplay=lna.sch>
<OpenDisplay=1>
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<RunScript=0>
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<FrameText0=Title>
<FrameText1=Drawn By:>
<FrameText2=Date:>
<FrameText3=Revision:>
</Properties>
<Symbol>
</Symbol>
<Components>
</Components>
<Wires>
</Wires>
<Diagrams>
<Smith 300 340 200 200 3 #c0c0c0 1 00 1 0 1 1 1 0 4 1 1 0 1 1 315 0 225 "" "" "" "">
<"S[1,1]" #0000ff 0 3 0 0 0>
</Smith>
<Smith 670 340 200 200 3 #c0c0c0 1 00 1 0 1 1 1 0 4 1 1 0 1 1 315 0 225 "" "" "" "">
<"S[2,2]" #0000ff 0 3 0 0 0>
</Smith>
<Smith 300 600 200 200 3 #c0c0c0 1 00 1 0 1 1 1 0 4 1 1 0 1 1 315 0 225 "" "" "" "">
<"S[1,2]" #0000ff 0 3 0 0 0>
</Smith>
<Smith 660 600 200 200 3 #c0c0c0 1 00 1 0 1 1 1 0 4 1 1 0 1 1 315 0 225 "" "" "" "">
<"S[2,1]" #0000ff 0 3 0 0 0>
</Smith>
<Rect 450 1250 240 160 3 #c0c0c0 1 11 1 2e+07 5e+07 2e+08 1 10 5 18.4033 1 -1 1 1 315 0 225 "" "" "" "">
<"S[2,1]" #0000ff 0 3 0 0 0>
</Rect>
<Rect 640 1490 240 160 3 #c0c0c0 1 00 1 0 2e-07 1e-06 1 -2 1 0.191207 1 -1 1 1 315 0 225 "" "" "" "">
<"in.Vt" #0000ff 0 3 0 0 0>
<"out.Vt" #ff0000 0 3 0 0 0>
</Rect>
<Tab 230 1510 300 200 3 #c0c0c0 1 00 1 0 1 1 1 0 1 1 1 0 1 1 315 0 225 "" "" "" "">
<"V1.I" #0000ff 0 3 1 0 0>
</Tab>
<Tab 260 977 742 247 3 #c0c0c0 1 00 1 1372 1 1 1 0 1 1 1 0 1 2000 315 0 225 "" "" "" "">
<"S[1,1]" #0000ff 0 3 0 0 0>
<"S[1,2]" #0000ff 0 3 0 0 0>
<"S[2,1]" #0000ff 0 3 0 0 0>
<"S[2,2]" #0000ff 0 3 0 0 0>
</Tab>
<Rect 280 1720 240 160 3 #c0c0c0 1 00 1 0 0.2 1 1 -0.1 0.5 1.1 1 -0.1 0.5 1.1 315 0 225 "" "" "" "">
<"in.Vt" #0000ff 0 3 0 0 0>
</Rect>
<Rect 750 1250 240 160 3 #c0c0c0 1 00 1 0 0.2 1 1 -0.1 0.5 1.1 1 -0.1 0.5 1.1 315 0 225 "" "" "" "">
<"S[1,1]" #0000ff 0 3 0 0 0>
</Rect>
</Diagrams>
<Paintings>
</Paintings>

84
sim/lna.sch Normal file
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<Qucs Schematic 0.0.20>
<Properties>
<View=-134,-188,1173,792,1,0,0>
<Grid=10,10,1>
<DataSet=lna.dat>
<DataDisplay=lna.dpl>
<OpenDisplay=0>
<Script=lna.m>
<RunScript=0>
<showFrame=0>
<FrameText0=Title>
<FrameText1=Drawn By:>
<FrameText2=Date:>
<FrameText3=Revision:>
</Properties>
<Symbol>
</Symbol>
<Components>
<.DC DC1 1 830 330 0 46 0 0 "26.85" 0 "0.001" 0 "1 pA" 0 "1 uV" 0 "no" 0 "150" 0 "no" 0 "none" 0 "CroutLU" 0>
<SPICE X1 1 400 260 -26 -97 1 2 "/home/kelvin/src/iss-lna/sim/models/BFU520_SPICE_GP.PRM" 1 "_net1,_net2,_net3" 0 "yes" 0 "none" 0>
<GND * 5 400 350 0 0 0 0>
<GND * 5 280 350 0 0 0 0>
<GND * 5 0 350 0 0 0 0>
<C C1 1 60 230 -26 17 0 0 "100 nF" 1 "" 0 "neutral" 0>
<GND * 5 740 360 0 0 0 0>
<C C2 1 690 230 -26 17 0 0 "100 nF" 1 "" 0 "neutral" 0>
<.SP SP1 1 810 440 0 77 0 0 "lin" 1 "20 MHz" 1 "200 MHz" 1 "2000" 1 "no" 0 "1" 0 "2" 0 "no" 0 "no" 0>
<Pac P2 1 740 290 18 -26 0 1 "2" 1 "50 Ohm" 1 "-200 dBm" 0 "144 MHz" 0 "26.85" 0>
<Pac P1 1 0 280 -94 -26 1 1 "1" 1 "50 Ohm" 1 "-60 dBm" 0 "144 MHz" 0 "26.85" 0>
<Vdc V1 1 520 20 18 -26 0 1 "5 V" 1>
<GND * 5 520 70 0 0 0 0>
<R R4 1 440 40 -93 -26 1 1 "120 Ohm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<GND * 5 920 260 0 0 0 0>
<R R5 1 370 100 -26 15 0 0 "3.9 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<R R1 1 280 300 15 -26 0 1 "1.2 kOhm" 1 "26.85" 0 "0.0" 0 "0.0" 0 "26.85" 0 "european" 0>
<L L1 1 150 230 -26 10 0 0 "72 nH" 1 "" 0>
<GND *1 5 210 350 0 0 0 0>
<GND *2 5 520 350 0 0 0 0>
<L L2 1 600 230 -26 10 0 0 "37 nH" 1 "" 0>
<C C4 1 520 320 15 -20 0 1 "4.1 pF" 1 "" 0 "neutral" 0>
<C C3 1 210 320 15 -20 0 1 "8.3 pF" 1 "" 0 "neutral" 0>
<.TR TR1 1 500 490 0 77 0 0 "lin" 1 "0" 1 "200 n" 1 "10000" 0 "Euler" 0 "2" 0 "100 ps" 0 "1e-16" 0 "150" 0 "0.001" 0 "1 pA" 0 "1 uV" 0 "26.85" 0 "1e-3" 0 "1e-6" 0 "1" 0 "CroutLU" 0 "no" 0 "yes" 0 "0" 0>
</Components>
<Wires>
<400 320 400 330 "" 0 0 0 "">
<430 290 430 330 "" 0 0 0 "">
<400 330 400 350 "" 0 0 0 "">
<400 330 430 330 "" 0 0 0 "">
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<520 230 570 230 "" 0 0 0 "">
<630 230 660 230 "" 0 0 0 "">
<210 230 280 230 "" 0 0 0 "">
<440 230 520 230 "" 0 0 0 "">
<0 230 0 230 "in" 30 200 0 "">
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<Diagrams>
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<Paintings>
<Text 750 10 12 #000000 0 "Ideal values:\nL1 = 72.9 nH\nC3 = 8.4 pF\nL2 = 36.4 nH\nC4 = 4.09 pF">
</Paintings>

59
sim/models/BFU520A_SPICE_GP.PRM Normal file
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* Filename: BFU520A_GP_SPICE.PRM
* BFU520A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520A 1 2 3
Q1 6 5 7 7 BFU520D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 215f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520W_SPICE_GP.PRM Normal file
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* Filename: BFU520W_GP_SPICE.PRM
* BFU520W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520W 1 2 3
Q1 6 5 7 7 BFU520D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 215f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520XR_SPICE_GP.PRM Normal file
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* Filename: BFU520XR_GP_SPICE.PRM
* BFU520XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520XR 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
* +IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

19
sim/models/BFU520XR_SPICE_GP.PRM.lst Normal file
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.Def:BFU520XR_SPICE_GP_PRM _net1 _net2 _net3 _ref
.Def:BFU520XR _ref _net1 _net2 _net3
BJT:Q1 _net5 _net6 _net7 _net7 Type="npn" Is="7.149e-17" Bf="133.81" Nf="1" Vaf="183.69" Ikf="0.25272" Ise="8.94e-14" Ne="2.5" Br="0.51249" Nr="1" Var="2.4" Ikr="0.03159" Isc="7.149e-17" Nc="1.1" Rb="1.17" Irb="0.02678" Rbm="0.67" Re="0.59" Rc="0.89" Cje="0" Vje="0.75" Mje="0.33" Cjc="0" Vjc="0.75" Mjc="0.33" Xcjc="1" Cjs="0" Vjs="0.75" Mjs="0" Fc="0.5" Vtf="0" Tf="0" Xtf="0" Itf="0" Tr="0"
L:LC_WIRE _net9 _net6 L="316p"
L:LB_WIRE _net4 _net5 L="1130p"
L:LE_WIRE _net7 _net8 L="400p"
L:LC_LEAD _net1 _net9 L="79p"
L:LB_LEAD _net2 _net4 L="0.001p"
L:LE_LEAD _net3 _net8 L="0.001p"
C:CCB _net4 _net9 C="10f"
C:CBASEPAD _net5 _net6 C="215f"
C:CBE _net4 _net8 C="40f"
C:CCE _net8 _net9 C="205f"
C:CEMITTERPAD _net6 _net7 C="235f"
.Def:End
Sub:X1 _ref _net1 _net2 _net3 Type="BFU520XR"
.Def:End

59
sim/models/BFU520X_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU520X_GP_SPICE.PRM
* BFU520X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520X 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
+IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU520_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU520_GP_SPICE.PRM
* BFU520 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU520D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU520 1 2 3
Q1 6 5 7 7 BFU520D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 215f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 235f
*
.MODEL BFU520D NPN
+IS 71.49E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 252.72E-3
+ISE 89.40E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 31.59E-3
+ISC 71.49E-18
+NC 1.10
+RB 1.17
+IRB 26.78E-3
+RBM 0.67
+RE 0.59
+RC 0.89
* +IMAX 2.00
+CJE 506.04E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 74.16E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 42.55E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

19
sim/models/BFU520_SPICE_GP.PRM.lst Normal file
View File

@ -0,0 +1,19 @@
.Def:BFU520_SPICE_GP_PRM _net1 _net2 _net3 _ref
.Def:BFU520 _ref _net1 _net2 _net3
BJT:Q1 _net5 _net6 _net7 _net7 Type="npn" Is="7.149e-17" Bf="133.81" Nf="1" Vaf="183.69" Ikf="0.25272" Ise="8.94e-14" Ne="2.5" Br="0.51249" Nr="1" Var="2.4" Ikr="0.03159" Isc="7.149e-17" Nc="1.1" Rb="1.17" Irb="0.02678" Rbm="0.67" Re="0.59" Rc="0.89" Cje="0" Vje="0.75" Mje="0.33" Cjc="0" Vjc="0.75" Mjc="0.33" Xcjc="1" Cjs="0" Vjs="0.75" Mjs="0" Fc="0.5" Vtf="0" Tf="0" Xtf="0" Itf="0" Tr="0"
L:LC_WIRE _net9 _net6 L="368p"
L:LB_WIRE _net4 _net5 L="990p"
L:LE_WIRE _net7 _net8 L="500p"
L:LC_LEAD _net1 _net9 L="92p"
L:LB_LEAD _net2 _net4 L="0.001p"
L:LE_LEAD _net3 _net8 L="0.001p"
C:CCB _net4 _net9 C="10f"
C:CBASEPAD _net5 _net6 C="215f"
C:CBE _net4 _net8 C="40f"
C:CCE _net8 _net9 C="205f"
C:CEMITTERPAD _net6 _net7 C="235f"
.Def:End
Sub:X1 _ref _net1 _net2 _net3 Type="BFU520"
.Def:End

59
sim/models/BFU530A_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU530A_GP_SPICE.PRM
* BFU530A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530A 1 2 3
Q1 6 5 7 7 BFU530D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 280f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530W_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU530W_GP_SPICE.PRM
* BFU530W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530W 1 2 3
Q1 6 5 7 7 BFU530D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 280f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530XR_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU530XR_GP_SPICE.PRM
* BFU530XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530XR 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530X_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU530X_GP_SPICE.PRM
* BFU530X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530X 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

41
sim/models/BFU530_GP_die.txt Normal file
View File

@ -0,0 +1,41 @@
*
* NXP SEMICONDUCTORS Version: 1.0
* Date: November 2013
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU530_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU530_GP_SPICE.PRM
* BFU530 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU530D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU530 1 2 3
Q1 6 5 7 7 BFU530D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 280f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 255f
*
.MODEL BFU530D NPN
+IS 95.32E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 336.96E-3
+ISE 119.20E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 42.12E-3
+ISC 95.32E-18
+NC 1.10
+RB 0.87
+IRB 35.71E-3
+RBM 0.50
+RE 0.44
+RC 0.67
+IMAX 2.00
+CJE 674.72E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 98.88E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 56.74E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550A_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU550A_GP_SPICE.PRM
* BFU550A SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT23 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550A 1 2 3
Q1 6 5 7 7 BFU550D
* SOT23 parasitic model
Lc_wire 9 6 240p
Lb_wire 4 5 1000p
Le_wire 7 8 1300p
Lc_lead 1 9 60p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 300f
Cbe 4 8 65f
Cce 8 9 95f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550W_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU550W_GP_SPICE.PRM
* BFU550W SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT323 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550W 1 2 3
Q1 6 5 7 7 BFU550D
* SOT23 parasitic model
Lc_wire 9 6 360p
Lb_wire 4 5 800p
Le_wire 7 8 950p
Lc_lead 1 9 90p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 65f
Cbasepad 5 6 300f
Cbe 4 8 45f
Cce 8 9 45f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550XR_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU550XR_GP_SPICE.PRM
* BFU550XR SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143XR DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550XR 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550X_SPICE_GP.PRM Normal file
View File

@ -0,0 +1,59 @@
* Filename: BFU550X_GP_SPICE.PRM
* BFU550X SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143X DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550X 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 316p
Lb_wire 4 5 1130p
Le_wire 7 8 400p
Lc_lead 1 9 79p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

41
sim/models/BFU550_GP_die.txt Normal file
View File

@ -0,0 +1,41 @@
*
* NXP SEMICONDUCTORS Version: 1.0
* Date: November 2013
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU550_SPICE_GP.PRM Normal file
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* Filename: BFU550_GP_SPICE.PRM
* BFU550 SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: November 2013
*
* PACKAGE: SOT143 DIE MODEL: BFU550D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU550 1 2 3
Q1 6 5 7 7 BFU550D
* SOT143 parasitic model
Lc_wire 9 6 368p
Lb_wire 4 5 990p
Le_wire 7 8 500p
Lc_lead 1 9 92p
Lb_lead 2 4 0.001p
Le_lead 3 8 0.001p
Ccb 4 9 10f
Cbasepad 5 6 300f
Cbe 4 8 40f
Cce 8 9 205f
Cemitterpad 6 7 270f
*
.MODEL BFU550D NPN
+IS 119.15E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 421.20E-3
+ISE 149.00E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 56.25E-3
+ISC 119.15E-18
+NC 1.10
+RB 0.70
+IRB 44.63E-3
+RBM 0.40
+RE 0.36
+RC 0.54
+IMAX 2.00
+CJE 843.40E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 123.60E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 70.92E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU580G_SPICE_GP.PRM Normal file
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* Filename: BFU580G_GP_SPICE.PRM
* BFU580G SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT223 DIE MODEL: BFU580D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU580G 1 2 3
Q1 6 5 7 7 BFU580D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 1040p
Le_wire 7 8 1040p
Lc_lead 1 9 800p
Lb_lead 2 4 560p
Le_lead 3 8 260p
Ccb 4 9 100f
Cbasepad 5 6 435f
Cbe 4 8 200f
Cce 8 9 650f
Cemitterpad 6 7 500f
*
.MODEL BFU580D NPN
+IS 142.98E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 505.44E-3
+ISE 178.80E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 63.18E-3
+ISC 142.98E-18
+NC 1.10
+RB 0.585
+IRB 53.56E-3
+RBM 0.335
+RE 0.295
+RC 0.445
+IMAX 2.00
+CJE 1012.08E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 148.32E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 85.11E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU580Q_SPICE_GP.PRM Normal file
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* Filename: BFU580Q_GP_SPICE.PRM
* BFU580Q SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT89 DIE MODEL: BFU580D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU580Q 1 2 3
Q1 6 5 7 7 BFU580D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 2200p
Le_wire 7 8 1520p
Lc_lead 1 9 650p
Lb_lead 2 4 0.001p
Le_lead 3 8 380p
Ccb 4 9 240f
Cbasepad 5 6 310f
Cbe 4 8 200f
Cce 8 9 550f
Cemitterpad 6 7 500f
*
.MODEL BFU580D NPN
+IS 142.98E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 505.44E-3
+ISE 178.80E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 63.18E-3
+ISC 142.98E-18
+NC 1.10
+RB 0.585
+IRB 53.56E-3
+RBM 0.335
+RE 0.295
+RC 0.445
+IMAX 2.00
+CJE 1012.08E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 148.32E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 85.11E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU590G_SPICE_GP.PRM Normal file
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* Filename: BFU590G_GP_SPICE.PRM
* BFU590G SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT223 DIE MODEL: BFU590D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU590G 1 2 3
Q1 6 5 7 7 BFU590D
* SOT223 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 1500p
Le_wire 7 8 1040p
Lc_lead 1 9 800p
Lb_lead 2 4 0.001p
Le_lead 3 8 260p
Ccb 4 9 250f
Cbasepad 5 6 725f
Cbe 4 8 110f
Cce 8 9 600f
Cemitterpad 6 7 450f
*
.MODEL BFU590D NPN
+IS 476.61E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 1684.8E-3
+ISE 596.0E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 210.6E-3
+ISC 476.61E-18
+NC 1.10
+RB 0.1755
+IRB 178.53E-3
+RBM 0.1005
+RE 0.0885
+RC 0.1335
+IMAX 2.00
+CJE 3373.6E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 494.4E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 283.7E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS

59
sim/models/BFU590Q_SPICE_GP.PRM Normal file
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* Filename: BFU590Q_GP_SPICE.PRM
* BFU590Q SPICE MODEL
* NXP SEMICONDUCTORS version 1.0
* Date: January 2014
*
* PACKAGE: SOT89 DIE MODEL: BFU590D
* 1: COLLECTOR; 2: BASE; 3: EMITTER
.SUBCKT BFU590Q 1 2 3
Q1 6 5 7 7 BFU590D
* SOT89 parasitic model
Lc_wire 9 6 0.001p
Lb_wire 4 5 2200p
Le_wire 7 8 1600p
Lc_lead 1 9 500p
Lb_lead 2 4 0.001p
Le_lead 3 8 400p
Ccb 4 9 250f
Cbasepad 5 6 725f
Cbe 4 8 110f
Cce 8 9 600f
Cemitterpad 6 7 450f
*
.MODEL BFU590D NPN
+IS 476.61E-18
+BF 133.81
+NF 1.00
+VAF 183.69
+IKF 1684.8E-3
+ISE 596.0E-15
+NE 2.50
+BR 512.49E-3
+NR 1.00
+VAR 2.40
+IKR 210.6E-3
+ISC 476.61E-18
+NC 1.10
+RB 0.1755
+IRB 178.53E-3
+RBM 0.1005
+RE 0.0885
+RC 0.1335
+IMAX 2.00
+CJE 3373.6E-15
+VJE 950.00E-3
+MJE 335.33E-3
+CJC 494.4E-15
+VJC 720.00E-3
+MJC 318.44E-3
+XCJC 0.50
+FC 850.00E-3
+TF 10.04E-12
+XTF 10.00
+VTF 1.00
+ITF 283.7E-3
+PTF 0.00
+TR 0.00
+KF 109.67e-12
+AF 2.00
.ENDS