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Fix back solder mask for SMA connectors

This commit is contained in:
Kelvin Ly 2019-07-18 18:53:27 -04:00
parent 37c8d5416c
commit 7e5dbb172b
4 changed files with 71084 additions and 13 deletions
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71073
pcb/iss-lna/fp-info-cache
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File diff suppressed because it is too large Load Diff

16
pcb/iss-lna/iss-lna.kicad_pcb
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@ -234,7 +234,7 @@
(net 1 GND))
)
(module iss_lna:142-0701-801-with-taper (layer F.Cu) (tedit 5D29650D) (tstamp 5D2857C6)
(module iss_lna:142-0701-801-with-taper (layer F.Cu) (tedit 5D30F82D) (tstamp 5D2857C6)
(at 143.965 57.5 270)
(path /5D244E7D)
(fp_text reference J4 (at -7.3 2.765) (layer F.SilkS)
@ -253,7 +253,7 @@
(xy -2.13 -2.025) (xy -2.59 -0.75) (xy -3.3 1.81) (xy 1.68 1.81) (xy 1.68 -3.73)
) (width 0))
))
(pad 1 smd custom (at -0.04 7.28 270) (size 0.9652 0.9652) (layers F.Cu)
(pad 1 smd custom (at -0.04 7.28 270) (size 0.9652 0.9652) (layers F.Cu F.Paste F.Mask)
(net 9 "Net-(C12-Pad2)") (zone_connect 0)
(options (clearance outline) (anchor rect))
(primitives
@ -284,13 +284,13 @@
(net 1 GND))
(pad 2 thru_hole circle (at 4.3815 5.969 270) (size 0.9652 0.9652) (drill 0.4572) (layers *.Cu *.Mask)
(net 1 GND))
(pad 2 smd rect (at -4.3815 2.65 270) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask)
(pad 2 smd rect (at -4.3815 2.65 270) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd rect (at 4.3815 2.665 270) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask)
(pad 2 smd rect (at 4.3815 2.665 270) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
)
(module iss_lna:142-0701-801-with-taper (layer F.Cu) (tedit 5D296503) (tstamp 5D28578C)
(module iss_lna:142-0701-801-with-taper (layer F.Cu) (tedit 5D30F82D) (tstamp 5D28578C)
(at 79 57.39 90)
(path /5D24503E)
(fp_text reference J1 (at 6.52 2.46) (layer F.SilkS)
@ -309,7 +309,7 @@
(xy -2.13 -2.025) (xy -2.59 -0.75) (xy -3.3 1.81) (xy 1.68 1.81) (xy 1.68 -3.73)
) (width 0))
))
(pad 1 smd custom (at -0.04 7.28 90) (size 0.9652 0.9652) (layers F.Cu)
(pad 1 smd custom (at -0.04 7.28 90) (size 0.9652 0.9652) (layers F.Cu F.Paste F.Mask)
(net 2 "Net-(C1-Pad1)") (zone_connect 0)
(options (clearance outline) (anchor rect))
(primitives
@ -340,9 +340,9 @@
(net 1 GND))
(pad 2 thru_hole circle (at 4.3815 5.969 90) (size 0.9652 0.9652) (drill 0.4572) (layers *.Cu *.Mask)
(net 1 GND))
(pad 2 smd rect (at -4.3815 2.65 90) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask)
(pad 2 smd rect (at -4.3815 2.65 90) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd rect (at 4.3815 2.665 90) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask)
(pad 2 smd rect (at 4.3815 2.665 90) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
)

2
pcb/iss-lna/iss-lna.kicad_pcb-bak
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@ -1653,7 +1653,7 @@
(gr_text "U.FL calibration plane" (at 100.3 70.175) (layer F.SilkS)
(effects (font (size 0.6 0.6) (thickness 0.1)))
)
(gr_text "BFU520R LNA Test Board, Rev. 1" (at 112.8 45.1) (layer F.SilkS)
(gr_text "BFU520R Amplifier Test Board, Rev. 1" (at 112.8 45.1) (layer F.SilkS)
(effects (font (size 1.2 1.2) (thickness 0.15)))
)
(gr_text OUT (at 142.2 64.5) (layer F.SilkS)

6
pcb/iss-lna/iss_lna.pretty/142-0701-801-with-taper.kicad_mod
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@ -1,4 +1,4 @@
(module 142-0701-801-with-taper (layer F.Cu) (tedit 5D29649C)
(module 142-0701-801-with-taper (layer F.Cu) (tedit 5D30F82D)
(fp_text reference REF** (at 6.52 2.46 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
@ -6,8 +6,8 @@
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.6 0) (end 5.6 0) (layer F.Fab) (width 0.12))
(pad 2 smd rect (at 4.3815 2.665) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask))
(pad 2 smd rect (at -4.3815 2.65) (size 2.413 4.83) (layers B.Cu F.Paste F.Mask))
(pad 2 smd rect (at 4.3815 2.665) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at -4.3815 2.65) (size 2.413 4.83) (layers B.Cu B.Paste B.Mask))
(pad 2 thru_hole circle (at 4.3815 5.969) (size 0.9652 0.9652) (drill 0.4572) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at -4.3815 5.969) (size 0.9652 0.9652) (drill 0.4572) (layers *.Cu *.Mask))
(pad 1 smd rect (at 0 5.3721) (size 2.6162 0.254) (layers F.Cu F.Paste F.Mask))